Automatic Compact Structure Sintering Die Bonder SDB200 Wafer Loading

Introduction:

It is designed for power semiconductor IC bonding market, equipped with more powerful BONDHEAD system, which possesses functions like high precision bonding, pressure holding circuit maintaining and heating, achieving the presintering bonding of electric components for high precision heating system.

Features:

• Die bonding ability with high speed and high accuracy
• Placement head and platform with heating function
• Temperature control system with high accuracy
• Accurate force control system
• Wafer loading support
• Automatic nozzle change
• Automatic pin base change
• Compact structure and small occupying area

Product Advantage:

High precision Placement accuracy: ±10um Rotation accuracy:±0.15°
Stable motion Compact structure and self-developed gravity balance system make motion stable
Wafer loading 8 inches wafer standard support
Nozzle base Nozzle auto-change with 5 nozzles

Main application:

Presintering die bonder is suit able for IGBT, SiC, DTS, resistance and other high temperature

presintering processes. It is mainly used in power module, power supply module, new energy,

smart grid and other industry areas.

Product Parameters:

Notices:

1,Leakage protection switch: ≥100ma

2,Compressed air requirement: 0.4-0.6Mpa

Inlet pipe specification: Ø10mm

3,Vacuum requirement:<-88kPa

Inlet pipe specification: Ø10mm

Tracheal joint: 2 pieces

4,Power requirements:

①Voltage: AC220V, frequency 50/60HZ

②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA

5,The ground is required to withstand a pressure of 800kg/m²

Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering machine, vertical oven, printer and etc has always maintained a leading position in technology, and provided professional electronic equipment solutions for many well-known enterprises at home and abroad.

With modern industrial parks and advanced R&D facilities, Suneast technology has strong system integration capabilities in R&D, design, production, automation and information equipment manufacturing. Its sales network is all over the world. Suneast technology has been achieved technical strategic cooperation with Tsinghua University, Chinese University of Hong Kong, Hong Kong University of Science and Technology and Harbin Institute of Technology, and its R&D capabilities has reached the advanced level at home and abroad.

In the core area of Guangdong-Hong Kong-Macao Greater Bay Area, Suneast technology has served semiconductor back-end application customers for more than 40 years, its downstream and end customers include Huawei, ZTE, TCL, Hikvision, MLS LIGHTING, DBG, DESAYSV AUTOMOTIVE, SHENZHEN MTC, JFLED, etc.

The dual drive gantry synchronous follow linear motor technology has been successfully applied to a number of high-speed and high-precision equipment manufacturing and processing fields, and gains great praise by users. The new semiconductor packaging equipment, like chip bonder is the masterpiece of Suneast technology, which helps the development of domestic chip industry. Today, Suneast technology has become the leader of China's intelligent equipment industry.

As the core enterprise of Sino ICT Holdings, Suneast technology will strengthen the strategic goal of the group and become a world-class enterprise in the field of high technology.

Culture

Vision

To be the leader in the global SMT intelligent equipment industry and the champion in the semiconductor equipment sub-industry!

Maintain leading technology level, R&D strength, industrial scale, and management model, and become the leader of the global SMT intelligent equipment industry and the champion of the semiconductor equipment sub-industry!

  Mission