F4BME245 low DK 2.45 PTFE laminates CCL double sided Copper Clad Laminate with reverse-treated (RTF) copper foil

F4BME245 Copper Clad Laminate: Premium Low-PIM Solution for High-Frequency Circuits

Taizhou Wangling presents the F4BME245, a high-performance PTFE glass fabric reinforced copper clad laminate engineered specifically for applications demanding exceptional passive intermodulation (PIM) performance. As a premium member of our F4BME series, this material combines superior electrical properties with advanced reverse treated copper foil technology to deliver unparalleled signal integrity in the most demanding RF and microwave environments.

Electrical Performance with Low-PIM Technology

The F4BME245 features a dielectric constant (Dk) of 2.45 ±0.05 at 10 GHz, providing stable and predictable electrical performance critical for controlled impedance designs. The dissipation factor (Df) is an exceptionally low 0.0012 at 10 GHz and 0.0017 at 20 GHz, ensuring minimal signal loss across broadband applications.

What truly distinguishes the F4BME245 is its outstanding PIM performance. With a PIM value of ≤ -159 dBc, this material is specifically optimized for applications where passive intermodulation distortion cannot be tolerated. The reverse treated copper foil (RTF) technology employed in F4BME series laminates provides:

• Superior PIM characteristics for high-sensitivity receiver systems
• More precise circuit line control through reduced copper surface roughness
• Lower conductor loss compared to standard electrodeposited copper
• Enhanced adhesion while maintaining excellent electrical performance

The thermal coefficient of dielectric constant is -120 ppm/°C, ensuring stable operation across the full temperature range of -55°C to +260°C. Volume resistivity exceeds 6×10⁶ MΩ·cm, while surface resistivity is ≥1×10⁶ MΩ, providing robust insulation properties.

Thermal and Mechanical Excellence

F4BME245 demonstrates outstanding thermal stability with a CTE of 20-25 ppm/°C in the XY direction and 187 ppm/°C in the Z direction. This balanced expansion characteristics ensure reliable plated through-hole integrity even under severe thermal cycling conditions. Thermal conductivity of 0.30 W/(M·K) facilitates effective heat dissipation from active components.

The material withstands thermal stress testing at 260°C for 10 seconds over three cycles without delamination, confirming its compatibility with lead-free assembly processes. With moisture absorption of only ≤0.08%, the laminate maintains consistent electrical performance in varying environmental conditions. The UL 94 V-0 flammability rating ensures compliance with safety requirements.

F4BME Data Sheet

Processing and Production

Our state-of-the-art manufacturing facilities employ advanced PTFE processing technologies to ensure consistent quality and performance. The production process involves precision-controlled impregnation of glass fabric with PTFE resin, followed by high-temperature lamination with reverse treated copper foil under goes controlled conditions.

Processing Advantages:

Compatible with standard FR-4 fabrication processes

RTF copper enables finer line resolution and tighter impedance control

Excellent machinability for drilling, routing, and shearing

Resistant to all common etching chemicals and solvents

Supports both through-hole and surface-mount technologies

The reverse treated copper foil used in F4BME245 features a specially roughened surface on the bonding side, providing superior adhesion without compromising the smooth signal-carrying surface. This results in reduced conductor loss and improved signal integrity, particularly at higher frequencies.

Production Capacity and Supply Chain Capabilities

As a leading manufacturer of PTFE-based circuit materials, we maintain significant production capacity to serve customers ranging from prototype development to high-volume production:

Standard Panel Sizes:

460×610mm, 500×600mm, 850×1200mm, 914×1220mm, and 1000×1200mm

Custom dimensions available including 300×250mm, 350×380mm, 500×500mm, 840×840mm, and 1000×1500mm

Copper Foil Options:

0.5 oz (0.018mm) and 1 oz (0.035mm) reverse treated copper foil

Additional copper weights available upon request

Thickness Options:

Dielectric thicknesses from 0.1mm to 12.0mm

For Dk ≤ 2.65, minimum dielectric thickness is 0.1mm

For Dk 2.7-3.0, minimum dielectric thickness is 0.2mm

Please specify whether ordering by total thickness or dielectric thickness

Storage and Transportation Guidelines

To maintain the exceptional quality and performance characteristics of F4BME245, we adhere to stringent storage and handling protocols:

Storage Requirements:

Store in a clean, dry environment at 10°C to 35°C

Maintain relative humidity below 70%

Keep in original moisture-resistant packaging until use

Avoid exposure to direct sunlight, corrosive gases, and extreme temperature fluctuations

Recommended shelf life: 12 months under proper storage conditions

Transportation:

Laminates are packaged with protective interleaving materials

Moisture-barrier packaging protects against humidity during transit

Secure edge protection prevents damage and warpage

Multiple packaging configurations available for domestic and international shipping

Full compliance with international shipping regulations for electronic materials

Specialized Configurations

For applications requiring enhanced thermal management or electromagnetic shielding, F4BME245 is also available in metal-backed configurations:

F4BME245-AL: Aluminum-backed for lightweight heat dissipation

F4BME245-CU: Copper-backed for maximum thermal conductivity

Why Choose F4BME245?

The F4BME245 represents the ideal solution for engineers who cannot compromise on signal integrity. With its ultra-low PIM performance, exceptional electrical stability, and compatibility with standard fabrication processes, this material delivers the performance of premium PTFE laminates with the practical advantages of modern manufacturing.

Our commitment to quality, flexible production capacity, and reliable global supply chain ensure that you receive consistent, high-performance materials exactly when you need them. Contact us today to discuss how F4BME245 can meet your most demanding RF application requirements.

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