| Sign In | Join Free | My ecer.co.uk |
|
| Sign In | Join Free | My ecer.co.uk |
|
| Categories | PCB Printed Circuit Board |
|---|---|
| Brand Name: | OEM/ODM |
| MOQ: | 1pcs |
| Price: | Negotiation |
| Payment Terms: | T/T,L/C |
| Delivery Time: | 5-7 days |
| Packaging Details: | Carton box |
| Service: | PCB Service |
| Company Info. |
| Shenzhen Jincheng Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Our PCB Manufacturing Solutions: Comprehensive Support for Your Electronic Design Needs
PCBs (Printed Circuit Boards) serve as the core carrier and connecting bridge of electronic products. Their design and manufacturing quality directly determines the performance, reliability, and cost of the final product.
To facilitate the successful implementation of various electronic products, we provide PCB manufacturing services covering all technical dimensions, from basic board types to high-end specialty boards, all capable of high-quality, customized production.
Standard PCB Product Line, Meeting a Wide Range of Application Scenarios
Single-sided Boards: Simple structure, economical cost, suitable for low-complexity circuits in home appliances, toys, and basic power supplies.
Double-sided Boards: Conductive lines are distributed on both sides of the substrate and connected by vias, offering high routing flexibility and cost-effectiveness, widely used in consumer electronics, industrial control, and automotive electronic modules.
Multilayer Boards: Composed of multiple layers of conductive and insulating layers alternately laminated, enabling high-density wiring, complex circuits, and high-speed signal transmission, suitable for computer motherboards, servers, high-end communication equipment, medical devices, and aerospace electronic systems. We can customize and produce multilayer boards with 4, 6, 8, and even 20 layers or more.
High-Density Interconnect Boards: Utilizing advanced technologies such as microvias and fine wires, these boards achieve extremely high wiring density, supporting miniaturization, lightweighting, and high-performance chip packaging needs. They are ideal for smartphones, wearable devices, and high-end communication chips.
Specialized PCB Technologies to Address Challenges in Professional Fields
Flexible and Rigid-Flex Boards: Using flexible substrates, these boards are suitable for space-constrained scenarios requiring bending, folding, or three-dimensional assembly, such as hinges for folding devices, camera modules, and medical wearable devices. Rigid-flex boards combine the advantages of rigid support and flexible connection, offering high design flexibility.
High-Frequency/High-Speed Boards: Manufactured using special low-loss materials, these boards have stable dielectric properties, effectively ensuring the transmission quality and impedance control accuracy of high-frequency microwave signals and high-speed digital signals. They are suitable for 5G base stations, millimeter-wave radar, and high-speed network equipment.
Metal Substrate: With a metal core, it boasts excellent heat dissipation performance, suitable for applications requiring efficient heat dissipation, such as high-power LED lighting, power modules, and automotive headlight drivers.
Thick Copper Plate: The conductive copper layer is significantly thicker than standard, providing strong high-current carrying capacity and excellent heat dissipation performance. Suitable for high-power power conversion, motor drives, and solar inverters.
End-to-End Manufacturing Services and Core Advantages
We not only offer a diverse range of PCB products but also provide complete manufacturing and support services to ensure efficient and reliable project progress.
Design and Technical Support: We provide professional manufacturability design checks, routing optimization support, and signal integrity/power integrity simulation services, ensuring product feasibility and optimizing costs from the design stage.
Precision Manufacturing Processes: We possess advanced processing capabilities ranging from standard mechanical drilling to laser micro-hole drilling, supporting high-precision linewidth and spacing requirements, and offering various surface treatment processes to meet different welding, wear resistance, and electrical performance needs. Strict Quality Control: A comprehensive quality management system throughout the entire process, combining automated optical inspection, flying probe/bed-of-needle testing, impedance testing, and various reliability tests, ensures the quality of every PCB delivered.
Flexible Production Mode: Supports all stages of production needs, from rapid prototyping and verification to small-batch pilot production and large-scale mass production, ensuring stable and reliable delivery.
One-Stop Service Extension: Provides a full-chain service from PCB manufacturing to component procurement, PCBA assembly, and functional testing, simplifying customer supply chain management.
PCB technology is continuously evolving towards higher density, higher frequency and speed, smaller and thinner dimensions, and greater environmental friendliness.
Choosing us means gaining a reliable partner capable of addressing future technological challenges and providing the key hardware foundation from concept to product. Whether your project falls into consumer electronics, automotive electronics, industrial control, medical devices, or aerospace, we can provide matching PCB solutions to help your innovative products be implemented efficiently and reliably.
| Items | Standard | Prototype |
| Maximum Layer Count | 36 | 60 |
| Maximum Board Thickness | 6 mm | 8 mm |
| Outer Layer Line Width / Spacing | 3.5 / 3.5 mil | 3.0 / 3.5 mil |
| Inner Layer Line Width / Spacing [1 oz Cu] | 3.5 / 3.5 mil | 3.0 / 3.5 mil |
| Inner Layer Line Width / Spacing [H oz Cu] | 2.8 / 2.8 mil | 2.5 / 2.5 mil |
| Line Width / Spacing [2 oz Cu] | 6/6mil | 5.5/5.5mil |
| Line Width / Spacing [3 oz Cu] | 8/8mil | 7/7mil |
| Line Width / Spacing [4 oz Cu] | 10/10mil | 9/9mil |
| Line Width / Spacing [5 oz Cu] | 12/12mil | 11/11mil |
| Line Width / Spacing [6 oz Cu] | 14/14mil | 13/13mil |
| Aspect Ratio | 20:1 | 25:1 |
| HDI Structure | 3 + N + 3 | 7 + N + 7 |
| Differential Impedance Tolerance | ±10% (Inner Layer, 1 oz Cu) | ±5% (Inner Layer, 1 oz Cu) |
| Gold Finger Bevel Tolerance | ±0.075 mm | ±0.05 mm |
| Registration Accuracy | 4.5 mil | 4 mil |
| Maximum Back Drill Stub | 8 mil | 6 mil |
| Minimum Drill Hole Diameter | 7 mil | 7 mil |
| Surface Treatment | ENIG,HASL (with/without lead),OSP,Immersion Tin,Immersion Silver,ENEPIG,Gold Fingers,Selective Gold | |
| Item | Standard | Prototype | |
| Layer Count | Flexible Area | Max 10 Layers | Max 20 Layers |
| Rigid Area | Max 14 Layers | Max 26 Layers | |
| Board Thickness | Flexible Area | Min 0.15 mm | Min 0.10 mm |
| Rigid Area | 0.6 – 2.0 mm | 0.5 – 6.0 mm | |
| Copper Thickness | Inner Layers | Max 1 oz | Max 2 oz |
| Outer Layers | 0.5 – 1 oz | 0.5 – 6 oz | |
| Maximum Size | Panel Size | 220 × 450 mm | 280 × 810 mm |
| Minimum Line Width / Spacing | Inner Layers | 4 / 4 mil | 2.5 / 2.5 mil |
| Outer Layers | 4 / 4 mil | 2.5 / 2.5 mil | |
| Minimum Hole Size / Pad | Flexible Area | 0.15 mm / 0.45 mm | 0.15 mm / 0.45 mm |
| Rigid Area | 0.20 mm / 0.50 mm | 0.15 mm / 0.40 mm | |
| Aspect Ratio | Laser Via | 0.8 : 1 | 1:01 |
| Mechanical Through Hole | 12:01 | 15:01 | |
| Minimum Dielectric Thickness | Inner Layer Flexible Core | 0.025 mm | 0.0125 mm |
| Inner Layer Rigid Core | 0.1 mm | 0.1 mm | |
| Prepreg | 0.075 mm | 0.05 mm | |
| Dimensional Tolerance | Rigid Area Outline | ±0.15 mm | ±0.10 mm |
| Flexible Area Outline | ±0.10 mm | ±0.075 mm | |
| Minimum Flexible Board Length | 2 mm | 2 mm | |
| HDI Capability | 3 + N + 3 | 5 + N + 5 | |
| Minimum Hole-to-Trace | 7 mil | 5 mil | |
| Minimum Hole-to-Flex-Rigid Edge | ≥1.0 mm | ≥0.8 mm | |
| Surface Treatment | ENIG, Electrolytic Gold, HASL (with/without lead), OSP, Immersion Tin, ENEPIG, Immersion Silver | ||
| Feature | Application |
| High Tg, High Performance, Low CTE | Computer,Communication,Automotive electronics,Suitable for high multilayer PCB |
| High Performance, Mid-Tg, Lead-free | Instruments,Computer,Consumer electronics,Automotive electronics,Power supplier and Industrial |
| Halogen-free, Mid-Tg | LED,Tablet,Smartphone,Automotive electronics,Communication equipment |
| High Tg, Halogen-free | Computer,Instrument,Smartphone,Consumer electronics,Automotive electronics |
| High Tg, halogen free, low loss | Backplane,Servers, Telecom, Base station,High performance computing |
| High Tg, halogen free, low loss | Radio frequency,Backplane,Servers, Telecom, Base station,High performance computing |
| PTFE-based, hydrocarbon-based very low loss materials | Radio frequency,Backplane,Servers, Telecom, Base station,High performance computing |
| High Tg | Consumer Electronics,Server, workstation,Automotive electronics |
| High Tg,Halogen Free | Backpanel,Servers, Telecom, Base station,Office Routers,High performance computing |
| Low Dk,Low Df | Radio frequency,Backplane,Servers, Telecom, Base station,High performance computing |
| Low Dk,Low Df | Cellular Base Station Antennas,Power Amplifiers,RFIDAutomotive Radar and Sensors, LNBs |
| Low Dk,Low Df | Direct broadcast satellites,power amplifiers and antennas,Remote meter readers,Patch antenna for wireless communications,Automotive radar applications |
| PI=1mil,CU=0.5/0.5 OZ | / |
| PI=2mil,CU=0.5/0.5 OZ | / |
| PI=3mil,CU=0.5/0.5 OZ | / |
| PI=2mil,CU=1/1 OZ | / |
| PI=3mil,CU=1/1 OZ | / |
| PI=1mil,CU=0.5/0.5 OZ | / |
| PI=1mil,CU=1/1 OZ | / |
| PI=2mil,CU=0.5/0.5 OZ | / |
| PI=2mil,CU=1/1 OZ | / |
| PI=1mil,CU=0.5/0.5 OZ | / |
| PI=2mil,CU=0.5/0.5 OZ | / |
| PI=3mil,CU=0.5/0.5 OZ | / |
| PI=1mil,CU=1/1 OZ | / |
| PI=2mil,CU=1/1 OZ | / |
| PI=3mil,CU=1/1 OZ | / |
|
