| Absolute Maximum Ratings |
| Collector-Emitter voltage | VCES | | V | | | 600 |
| Gate-Emitter voltage | VGES | | V | | | 20 |
| Collector current | IC | TC=100C | A | | | 150 |
| IC pulse | | 1ms | A | | | 300 |
| -IC | | | A | | | 150 |
| -IC pulse | | 1ms | A | | | 300 |
| Collector power dissipation | PC | 1 device | W | | | 650 |
| Junction temperature | Tj | | C | | | 175 |
| Operating junction temperature (under switching conditions) | Tjop | | C | | 150 | |
| Case temperature | TC | | C | | | 125 |
| Storage temperature | Tstg | | C | -40 | | 125 |
| Isolation voltage between terminal and copper base (*1) | Viso | AC : 1min. | VAC | | 2500 | |
| Screw torque Mounting (*2) | | | N m | | | 5.0 |
| Screw torque Terminals (*3) | | | N m | | | 5.0 |
| Electrical Characteristics |
| Zero gate voltage collector current | ICES | VGE = 0V, VCE = 600V | mA | | | 1.0 |
| Gate-Emitter leakage current | IGES | VCE = 0V, VGE = 20V | nA | | | 200 |
| Gate-Emitter threshold voltage | VGE (th) | VCE = 20V, IC = 150mA | V | 6.2 | 6.7 | 7.2 |
| Collector-Emitter saturation voltage (terminal) | VCE (sat) | VGE = 15V, IC = 150A, Tj=25C | V | | 1.75 | 2.20 |
| Collector-Emitter saturation voltage (terminal) | VCE (sat) | VGE = 15V, IC = 150A, Tj=125C | V | | 2.05 | |
| Collector-Emitter saturation voltage (terminal) | VCE (sat) | VGE = 15V, IC = 150A, Tj=150C | V | | | 2.25 |
| Collector-Emitter saturation voltage (chip) | VCE (sat) | VGE = 15V, IC = 150A, Tj=25C | V | | 1.60 | 2.05 |
| Collector-Emitter saturation voltage (chip) | VCE (sat) | VGE = 15V, IC = 150A, Tj=125C | V | | 1.90 | |
| Collector-Emitter saturation voltage (chip) | VCE (sat) | VGE = 15V, IC = 150A, Tj=150C | V | | | 2.00 |
| Internal gate resistance | RG (int) | | | | | 6 |
| Input capacitance | Cies | VCE = 10V, VGE = 0V, f = 1MHz | nF | | 9.7 | |
| Turn-on time | ton | VCC = 300V, LS = 30nH, IC = 150A, VGE = 15V, RG = 9, Tj = 150C | nsec | | 650 | |
| tr | | | nsec | | 300 | |
| tr (i) | | | nsec | | 100 | |
| Turn-off time | toff | | nsec | | 600 | |
| tf | | | nsec | | 40 | |
| Forward on voltage (terminal) | VF | VGE = 0V, IF = 150A, Tj=25C | V | | 1.70 | 2.15 |
| Forward on voltage (terminal) | VF | VGE = 0V, IF = 150A, Tj=125C | V | | 1.60 | |
| Forward on voltage (terminal) | VF | VGE = 0V, IF = 150A, Tj=150C | V | | | 1.57 |
| Forward on voltage (chip) | VF | VGE = 0V, IF = 150A, Tj=25C | V | | 1.60 | 2.05 |
| Forward on voltage (chip) | VF | VGE = 0V, IF = 150A, Tj=125C | V | | 1.50 | |
| Forward on voltage (chip) | VF | VGE = 0V, IF = 150A, Tj=150C | V | | | 1.47 |
| Reverse recovery time | trr | IF = 150A | nsec | | 200 | |
| Thermal Resistance Characteristics |
| Thermal resistance (1device) IGBT | Rth(j-c) | | C/W | | | 0.31 |
| Thermal resistance (1device) FWD | Rth(j-c) | | C/W | | | 0.60 |
| Contact thermal resistance (1device) (*4) | Rth(c-f) | with Thermal Compound | C/W | | 0.050 | |