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1.8mm Tower Type LED Lamps, LED Lamps, DIP LED , LOW POWER LED,INDICATED LED

Categories LED LAMPS
Brand Name: XIN MING HONG
Model Number: MH-8224SYG-139
Certification: ROHS certification
Place of Origin: CHINA
MOQ: 120000pcs
Price: USD 0.02/PCS
Payment Terms: T/T
Supply Ability: 50000000 /month
Delivery Time: 3-5 working days
Packaging Details: Products are packed in one bag of 4000pcs(one taping reel)
Color: Green
Package Size: 3.2x1.6x1.1mm(1206)
Forward Voltage: 1.9-2.4v
Luminous Intensity: 50-80mcd
Forward Current: 20MA
Domint Wave Length: 560-570
Viewing Angle: 120 deg
Operating Temperature: -40 to +85
Storage Temperature: -40 to +100
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1.8mm Tower Type LED Lamps, LED Lamps, DIP LED , LOW POWER LED,INDICATED LED

SHEN ZHEN XIN MING HONG ELECTRONIC CO.,LIMITED professional manufacture SMD LED for 10 years with good quality and best performance. Our products include 0603 0805 1206 3528 5050 etc.

3MM TOWER TYPE LED LAMPS

Features:

  • (1)suitable for all SMT asembly methods.
  • (2)compatible with infrared and vapor phase reflow solder process.
  • (3)compatible with automatic placement equipment.
  • (4)This product doesn't contain restriction substance,comply ROHS standard.

Applications:

  • Turn singals
  • Status indicators:comsumer & industrial
  • Backlighting:LCDS,Key pads adverstising
  • General use

Package Dimensions:


Electrical and optical characteristics(Ta=25Electrical and optical characteristics(Ta=25C)Electrical and optical characteristics(Ta=25C)Electrical and optical characteristics(Ta=25C)C)


ParameterSymbolMin.Typ.Max.UnitTest Condition
Luminous IntensityIv50---80mcdIf=20mA (Note 1)
Viewing Angle2θ1/2---120---Deg(Note 2)
Dominant Wave Lengthp560565570nmIF=20mA (Note 3)
Forward VoltageVF1.92.02.4VIF=20mA
Reverse CurrentIR------100µAVR=5V

Soldering

  • Reflow soldering

Preheating:140°C-160°C±5°C,within 2 minutes.

Operation heating:235°C(MAX.) within 10 seconds.

Gradual Cooling(Avoid quenching)

Preheating:140°C-160°C±5°C,within 2 minutes.

Operation heating:235°C(MAX.) within 10 seconds.

Gradual Cooling(Avoid quenching)


  • Dip soldering(wave soldering)

Preheating:120°C-150°C, within 120-180 sec

Operation heating:245°C±5°C within 5 sec.260°C(MAX)

Gradual cooling(Avoid quenching)


Reliablity test items and conditions:

The reliablity of products shall be satisfied with items listed below.

Confidence level:97%

LTPD:3%

NOItemTest ConditionsTest Hours/CycleSample SizeFailure Judgment CriteriaAC/RE
1Solder HeatTEMP:260°C±5ºC10 SEC76pcsIV≦Ivt*0.5 or VF≧U or VF≦L0/1
2Temperature CycleH:+100ºC 15min L:-40ºC 15min300 CYCLES76pcs0/1
3Thermal ShockH:+100ºC 5min~10sec L:-10ºC 5min300 CYCLES76pcs0/1
4High Temperature StorageTEMP:100°C1000HRS76pcs0/1
5Low Temperature StorageTEMP:-40°C1000HRS76pcs0/1
6DC Operating LifeTEMP:25°C If=20MA1000HRS76pcs0/1
7High Temperature/High Humidity85ºC /85℅RH1000HRS76pcs0/1

Note:Ivt:To test Iv value of the chip before the reliablility test

Iv:The test value of the chip that has completed the reliablility test

U: Upper specifications Limit

L: Lower specifications Limit


Product Tags:

led spec

  

p6 led display spec

  

led wall p3 specs

  
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