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RO4350B LoPro RF PCB Rogers 60.7mil Reverse Treated Foil PCB Circuit Board With Immersion Gold

Categories Arlon PCB Board
Brand Name: Bicheng Technologies Limited
Model Number: BIC-137-V0.25
Certification: UL
Place of Origin: China
MOQ: 1
Price: USD 2.99-8.99 PER PIECE
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
Delivery Time: 10 working days
Packaging Details: Vacuum
Number of Layers: 2
Glass Epoxy:: RO4350B LoPro 60.7mil (1.542mm), Tg 288℃
Final foil: 1 Oz
Final height of PCB:: 1.6 mm ±10%
Surface Finish: Immersion gold 0.025µm over 3µm Nickel
Solder Mask Color:: Green
Colour of Component Legend: White
Test: 100% Electrical Test prior shipment
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    RO4350B LoPro RF PCB Rogers 60.7mil Reverse Treated Foil PCB Circuit Board With Immersion Gold

    RO4350B LoPro RF PCB Rogers 60.7mil Reverse Treated Foil PCB Circuit Board With Immersion Gold

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    RO4350B LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4350B dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4350B laminate system.



    Features and Benefits:

    RO4350B materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

    1. Lower insertion loss

    2. Low PIM

    3. Increased signal integrity

    4. High circuit density


    Low Z-axis coefficient of thermal expansion

    1. Multi-layer board capability

    2. Design flexibility


    Lead-free process compatible

    1. High temperature processing

    2. Meets environmental concerns


    CAF resistant


    Our PCB Capability (RO4350B LoPro)

    PCB Material:Hydrocarbon Ceramic Laminates
    Designation:RO4350B LoPro
    Dielectric constant:3.48±0.05
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin etc..

    Some Typical Applications:

    1. Digital applications such as servers, routers, and high speed back planes

    2. Cellular base station antennas and power amplifiers

    3. LNB’s for direct broadcast satellites

    4. RF Identification Tags


    Typical Properties of RO4350B LoPro

    PropertyTypical ValueDirectionUnitsConditionTest Method
    Dielectric Constant, Process3.48 ± 0.05z--10 GHz/23°CIPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant, Design3.55z--8 to 40 GHzDifferential Phase Length Method
    Dissipation Factor tan,0.0037 0.0031z--10 GHz/23°C 2.5 GHz/23°CIPC-TM-650 2.5.5.5
    Thermal Coeffifi cient of r50zppm/°C-50°C to 150°CIPC-TM-650 2.5.5.5
    Volume Resistivity1.2 X 1010MΩ•cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity5.7 X 109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)zKV/mm(V/mil)0.51mm(0.020”)IPC-TM-650 2.5.6.2
    Tensile Modulus11473(1664)YMPa(kpsi)RTASTM D638
    Tensile Strength175(25.4)YMPa(kpsi)RTASTM D638
    Flexural Strength255(37)MPa(kpsi)IPC-TM-650 2.4.4
    Dimensional Stability<0.5X,Ymm/m(mils/inch)after etch +E2/150°CIPC-TM-650 2.4.39A
    Coeffifi cient of Thermal Expansion14xppm/°C-55 to 288°CIPC-TM-650 2.1.41
    16y
    35z
    Tg>280°C TMAAIPC-TM-650 2.4.24.3
    Td390°C TGAASTM D3850
    Thermal Conductivity0.62W/m/°K80°CASTM C518
    Moisture Absorption0.06%48 hrs immersion 0.060” sample Temperature 50°CASTM D570
    Density1.86gm/cm323°CASTM D792
    Copper Peel Strength0.88(5.0)N/mm(pli)after solder float 1 oz. TC FoilIPC-TM-650 2.4.8
    FlammabilityV-0UL 94
    Lead-Free Process CompatibleYes

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